March 19, 2021 — This year’s Hot Chips 33 (2021) will be held in Silicon Valley, August 22-24, 2021. The submission deadline for papers has been extended to April 7, and the submission deadline for posters is (still) April 29, 2021.
Schedule for Submissions
Deadline for submissions: Extended to April 7, 2021
Notification of acceptance: May 3, 2021
Deadline for final version: July 16, 2021
Deadline for poster submissions: April 29, 2021
Submit: https://www.softconf.com/k/hotchips33/
Areas of Interest
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General-Purpose Processor Chips
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High-Performance, Low-Power
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Multi-Core and Highly-Reliable Systems
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Domain-Specific Chips
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Machine Learning, Vision and Graphics Chips
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Data Analytics and Big Data Processing
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IoT and Always-On Functions
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Custom Chips for Emerging Applications
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Reconfigurable Chips
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Security
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Mobile and Embedded Devices
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Graphics/Multimedia/Gaming
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SoC, Security, and DSP Chips
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Communications and Networking
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Emerging Computing Architectures
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Neuromorphic
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Quantum Computing
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Memory Technologies
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Other Enabling Technologies
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Software and Systems for Emerging Hardware
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Programming Models, Runtime Systems
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Performance, Power, Debug and Evaluation
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2020 Archives Now Open!
For complete presentations as well as videos go to: https://www.hotchips.org/archives/hc32/
Hot Chips is sponsored by the Technical Committee on Microprocessors and Microcomputers of the IEEE Computer Society, Insilicon and technically co-sponsored by the IEEE Solid State Circuits Society.
Source: Hot Chips
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Hot Chips 33: Submission Deadline Extended to April 7 - HPCwire
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