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China's JCET confirms advanced packaging capability for chips below 5nm - DIGITIMES

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Advanced chip manufacturing and advanced packaging have now become the focus of attention in China. SMIC already confirmed that it had adopted deep ultraviolet (DUV) lithography machines to produce N+1 process (similar to 7nm process) chips in limited...

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April 12, 2024 at 10:57AM
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China's JCET confirms advanced packaging capability for chips below 5nm - DIGITIMES
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